SK2SHR230-1

REFERENCE MATERIAL ▼ DESCRIPTION ▼ MAX. USE T°C ▼ APPLICATION ▼
SK2SHR230-1ETFE basedMultilayer thermosetting ETFE shrink tape230 °CProvides release characteristics and moderate compaction at higher cure temperatures

ETFE based shrink film designed to provide release characteristics and moderate compaction forces at higher cure temperatures. It is a tought, flexible, high performance fluoropolymer release tape, which works well in a broad range of temperatures (until 230°C). SK2SHR230-1 is ideal for cure cycles above 180°C where moderate compaction force and effective release are needed in combination. In addition, the tape exhibits elongation characteristics that make it effective for wrapping and conforming over sharp corner radii and composite parts with non-uniform outside dimensions. Due to its combination of release, compaction and elongation characteristics, SK2SHR230-1 has become a popular replacement for composite application where PVF film was formerly used.

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